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林建宏
姓名:林建宏
職稱:專任副教授
辦公室:大義館 625-2 室
研究室:大義館 627 室
個人網頁:
聯絡電話:02-28610511分機33311
聯絡信箱:ljh13@staff.pccu.edu.tw
請益時間:一5,二:2,四 2-3,五 3-4
學歷:
國立清華大學微機電工程研究所博士
國立彰化師範大學工業教育與技術學系研究所碩士
國立成功大學機械工程系碩士
國立成功大學機械工程系學士
經歷:
中國文化大學機械工程系助理教授
清華大學動力機械工程學系專任博士後研究員
工研院機械所兼任特約人員
百容電子股份有限公司專任產品工程
專長:奈米轉印、奈米製造技術、微機電系統、發光二極體、顯示器
任教科目:
半導體製程技術導論 Introdution To Semiconductor Manufacturing
工廠實習 Machine Shop Practice
電路學 Electrical Circuit Theory
機械設計原理 Elements Of Machine Design
奈米加工技術 Nanofabrication Technology
應用電子學 Applied Electronics
基礎光學 Fundamental Optics
機械設計原理 Elements Of Machine Design
光電概論 Introduction To Optoelectronic
學術著作:期刊論文 / 研討會論文 / 專題研究計畫
期刊論文:
[1] P. Y. Tseng and C. H. Lin, “Impacts of mold material and pattern size for ultrasonic nanoimprint lithography,” Microelectronic Engineering, Vol. 98, pp. 112-116, 2012. (SCI)
[2] C. H. Lin and R. Chen, “New approaches of mold fabrication for nanoimprint lithography,” Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 10, No. 1, pp. 011506-1-6, 2011. (SCI)
[3] C. Y. Wang,P. Y. Tseng, and C. H. Lin, “Replication of polyethylene terephthalate (PET) nano/micro structures using ultrasonic nanoimprint,” Proceedings of 2011 IEEE Interna-tional Conference on Nano/Micro Engineered and Molecular Systems (NEMS), pp. 563-566, 2011. (EI)
[4] C. H. Lin, C. Y. Wang, and R. Chen, “Heating-Assisted for Ultrasonic Nanoimprint Li-thography,” Journal of Chinese Society of Mechanical Engineers, Vol. 31, No. 3, pp. 229-233, 2010. (SCI)
[5] C. H. Lin, C. Y. Wang, and R. Chen, “Assisted-Heating for Ultrasonic Nanoimprint Li-thography,” Proceedings of IEEE Conference on Nanotechnology, pp. 126-129, 2009. (EI)
[6] H. Hocheng, C. M. Chen, Y. C. Chou, and C. H. Lin, “Study of Novel Electrical Routing and Integrated Packaging on Bio-compatible flexible Substrates,” Microsystem Technolo-gies, Vol. 16, No. 3, pp. 423-430, 2009. (SCI)
[7] C. H. Lin and R. Chen, “Impact of Mold Geometries and Imprinted Resist Thickness on Velocity Fields for Nanoimprint Lithography,” Japanese Journal of Applied Physics, Vol. 47, No. 6, pp. 5197-5203, 2008. (SCI)
[8] C. H. Lin and R. Chen, “Effects of mold geometries and imprinted polymer resist thickness on ultrasonic nanoimprint lithography,” Journal of Micromechanics and Microengineering, Vol. 17, No 7, pp. 1220-1231, 2007. (SCI)
[9] Y. L. Lai and C. H. Lin, “Investigation of structures of microwave microelectromechanical system switches by taguchi method,” Japanese Journal of Applied Physics, Vol. 46, No 10, pp. 6539-6545, 2007. (SCI)
[10] C. H. Lin, R. Chen, C. C. Su, and F. Y. Chang, “Nanofabrication with ultrasonic nanoimprint lithography,” Proceedings of IEEE Conference on Nanotechnology, pp. 603-606, 2006. (EI)
[11] C. H. Lin and R. Chen, “Ultrasonic nanoimprint lithography: a new approach to nanopatterning,” Journal of Microlithography Microfabrication and Microsystems, Vol. 5, No. 1, pp. 011003-1-6, 2006.
[12] T. Y. Chen and C. H. Lin, “Whole-Field Digital Measurement of Principal Stress Directions in Photoelasticity,” Optics and Lasers in Engineering, Vol.30, No. 6, pp. 527-537, 1998.

研討會論文:
[1] S. Y. Liu, P. Y. Tseng, and C. H. Lin, “Finite Element Analysis of Antireflective SubwaveLength Periodic Structures,” 6th Asia-Pacific Conference on Transducers and Micro-Nano Technology, Nanjing, China, July 8-11, 2012.
[2] C. H. Lin and P. Y. Tseng, “The Design and Analysis in Passive Compliant Stage for Nanoimprint Lithography,” 6th Asia-Pacific Conference on Transducers and Micro-Nano Technology, Nanjing, China, July 8-11, 2012.
[3] P. Y. Tseng, R. Chen, C. H. Lin, S. H. Liao, “Impact of Mold Material for Ultrasonic Nanoimprint Lithography,” 37th International Conference on Micro and Nano Engineering, Berlin, Germany, Sep.19-23, 2011.
[4] P. Y. Tseng, R. Chen, C. H. Lin, “The Effects of Replicated Micro/Submicro Patterns Using Ultrasonic Nanoimprint,” International Conference on Materials for Advanced Technologies, Suntec, Singapore, Jun. 26- Jul. 1, 2011.
[5] H. C. Su, R. Chen, C. H. Lin, “Fabrication of Highly Ordered ZnO Nanowire Arrays Using Microcontact Printing,” International Conference on Materials for Advanced Technologies, Suntec, Singapore, Jun 26- Jul 1, 2011.
[6] C. Y. Wang, P. Y. Tseng, and C. H. Lin, “Replication of Polyethylene Terephthalate (PET) Nano/Micro Structures Using Ultrasonic Nanoimprint,” 6th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Kaohsiung, Taiwan, Feb. 20-23, 2011.
[7] C. H. Lin, C. Y. Wang, and H. C. Su, “The New Concepts of Mold Fabrication Technology for Nanoimprint lithography,” 5th Asia-Pacific Conference on Transducers and Micro-Nano Technology, Perth, Australia, Jul. 6-9, 2010.
[8] C. H. Lin, C. Y. Wang, and R. Chen, “Application of Taguchi Method in the Optimization of Fabrication Parameters for Heating-Assisted Ultrasonic Nanoimprint Lithography,” In-ternational Conference on Advanced Manufacturing, Kengting, Taiwan, Feb. 2-5, 2010.
[9] C. H. Lin, C. Y. Wang, C. T. Chuang, and R. Chen, “A New Hybrid Mold Technology for Ultraviolet Nanoimprint Lithography,” 22th International Microprocesses and Nanotech-nology Conference, Sapporo, Japan, Nov. 16-19, 2009.
[10] C. H. Lin, C. Y. Wang, and R. Chen, “Assisted-Heating for Ultrasonic Nanoimprint Li-thography,” 9th IEEE Conference on Nanotechnology, Genoa, Italian, Jul. 26-30, 2009.
[11] C. H. Lin and R. Chen, “Impact of mold geometries and imprinted resist thickness on ve-locity fields for nanoimprint lithography,” 20th International Microprocesses and Nano-technology Conference, Kyoto, Japan, Nov. 5-8, 2007.
[12] C. H. Lin, R. Chen, C. C. Su, and F. Y. Chang, “Nanofabrication with ultrasonic nanoimprint lithography,” 6th IEEE Conference on Nanotechnology, Cincinnati, USA, Jun. 17-20, 2006.
[13] 廖崧皓、林建宏,“碳粉與碳纖維製備導電高分子特性之研”,第七屆智慧生活科技研討會,國立勤益科技大學,2012。
[14] 傅書煥、林建宏,“陣列式導電高分子力量感測器的研製”,第七屆智慧生活科技研討會,國立勤益科技大學,2012。
[15] 蘇信政、曾柏源、林建宏,“微接觸微影法應用於選區成長垂直氧化鋅奈米線陣列”,中國機械工程學會第廿八屆全國學術研討會,台中中興大學,2011。
[16] 蘇信政、辛孟翰、林建宏,“奈米轉印模仁製程技術的新構想”,中國機械工程學會第廿七屆全國學術研討會,台北台北科技大學,2010。
[17] 辛孟翰、林建宏,“應用陽極氧化鋁於奈米轉印模仁製作之研究”,2011智慧型數位生活研討會,台北中國文化大學,2011。
[18] 簡佑軒、黃佳瑋、林建宏,“步進重複式奈米轉印平台之設計與實現”,中國機械工程學會第廿七屆全國學術研討會,台北台北科技大學,2010。
[19] 林佳暐、康育齊、陳榮順、林建宏,“CMOS MEMS Z 軸微加速度計與電容感測電路之整合及實現”,第十四屆奈米工程暨微系統技術研討會,高雄國立中山大學,2010。
[20] 林建宏、王志祐、陳榮順,“加熱輔助超音波奈米轉印技術”,中國機械工程學會第廿六屆全國學術研討會暨黃光治教授逝世十週年紀念會暨論文發表會,台南成功大學,2009。
[21] 林建宏、王志祐、陳榮順,“紫外光硬化奈米轉印之新式混和透明模仁技術”,中國機械工程學會第廿六屆全國學術研討會,台南成功大學,2009。
[22] 何銘浚、曾詩閔、陳楊哲、陳榮順、林建宏,“微液珠二維共平面式設計與控制”,中國機械工程學會第廿六屆全國學術研討會,台南成功大學,2009。
[23] 林逸昕、陳榮順、林建宏,“應用紫外光成型奈米壓印製程於可撓式基板”,中國機械工程學會第廿五屆全國學術研討會,彰化大葉大學,2008。
[24] 陳勇全、陳榮順、林建宏,“以影像為基礎之先進智慧概念車輛車道保持控制系統”,中國機械工程學會第廿五屆全國學術研討會,彰化大葉大學,2008。

專題研究計畫:
[1] 計畫名稱:發展週期性奈米轉印模仁技術於表面電漿子結構特性之研究
擔任工作:主持人
委託機構:國科會計畫
計畫編號:NSC 100-2221-E-034 -010
執行期間:100.8.1~101.7.31
[2] 計畫名稱:面電漿微影術之先導性研究
擔任工作:指導教授
委託機構:國科會大專生研究計畫
計畫編號:NSC 100-2815-C-034-002-E
執行期間:100.7.1~101.2.28
[3] 計畫名稱:昆蟲刺激與行為監測平台之控制與系統自動化
擔任工作:共同主持人
委託機構:國科會計畫
計畫編號:NSC 98-2221-E-007 -004 -MY3
執行期間:98.8.1~101.7.31
[4] 計畫名稱:發展超音波及紫外光硬化型奈米轉印技術於可撓式基板之應用
擔任工作:主持人
委託機構:國科會計畫
計畫編號:NSC 98-2221-E-034-005- MY2
執行期間:98.8.1~100.7.31
[5] 計畫名稱:發展超音波及紫外光硬化型奈米轉印技術於可撓式基板之應用
擔任工作:主持人
委託機構:國科會計畫
計畫編號:NSC 97-2218-E-034 -004
執行期間:97,9,1~98,7,31
[6] 計畫名稱:微型可穿戴自發電式無線傳輸多重健康訊號感測系統(2/3)
擔任工作:博士後研究員
委託機構:國科會計畫
計畫編號:NSC 95-2221-E-007-065- MY3
執行期間:96,7~97,6
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