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Lin Chien-hung

Name: Lin Chien-hung 
Title: Full-Time Assistant Professor
Office: Room 625-2, Da-Yi Building
Laboratory: Room 627, Da-Yi Building
Personal Website:
Phone Number: 02-28610511 ext. 33311 
E-mail Address: ljh13@staff.pccu.edu.tw 
Office Hours: Monday (Period 5), Tuesday (Period 2), Thursday (Periods 2-3), Friday (Periods 3-4)

Education:

  • Ph.D. in Micro-Electromechanical Engineering, National Tsing Hua University
  • M.S. in Industrial Education and Technology, National Changhua University of Education
  • M.S. in Mechanical Engineering, National Cheng Kung University
  • B.S. in Mechanical Engineering, National Cheng Kung University

Experience:

  • Assistant Professor, Department of Mechanical Engineering, Chinese Culture University
  • Full-Time Postdoc, Department of Power Mechanical Engineering, National Tsing Hua University
  • Part-Time Guest Worker, Mechanical and Systems Research Laboratories, Industrial Technology Research Institute (ITRI)
  •  Product Specialist Engineer, Excel Cell Electronic Co., Ltd.

Research Interests:

Nano Imprint, Nano-Manufacturing Technology, Micro-Electromechanical System, Light-Emitting Diode (LED), Liquid-Crystal Display (LCD)

 

Course Offerings:

  • Introduction to Semiconductor Manufacturing
  • Machine Shop PracticesElectrical Circuit Theory
  • Elements of Machine Design
  • Nanofabrication Technology
  • Applied Electronics
  • Fundamental Optics
  • Elements of Machine Design
  • Introduction to Optoelectronics

 

Academic publicationsJournal paper/Conference papers / NSC Project

Journal paper:
(1) T. Y. Chen and C. H. Lin, “Whole-Field Digital Measurement of Principal Stress Directions in Photoelasticity,” Optics and Lasers in Engineering, Vol.30, No. 6, pp. 527-537, 1998. (SCI, Impact Factor = 0.604)
(2) C. H. Lin and R. Chen, “Ultrasonic nanoimprint lithography: a new approach to nanopatterning,” Journal of Microlithography Microfabrication and Microsystems, Vol. 5, No. 1, pp. 011003-1-6, 2006. (SCI, Impact Factor = 1.243, Rank factor = 19/32 in Nanoscience & Nanotechnology and 53/206 in Electrical Engineering)
(3) C. H. Lin and R. Chen, “Effects of mold geometries and imprinted polymer resist thickness on ultrasonic nanoimprint lithography,” Journal of Micromechanics and Microengineering, Vol. 17, No 7, pp. 1220-1231, 2007. (SCI, Impact Factor = 2.321, Rank factor = 10/32 in Nanoscience & Nanotechnology, 27/176 in Materials Science, and 6/109 in Mechanics)
(4) Y. L. Lai and C. H. Lin, “Investigation of structures of microwave microelectromechanical-system switches by taguchi method,” Japanese Journal of Applied Physics, Vol. 46, No 10, pp. 6539-6545, 2007. (SCI, Impact Factor = 1.222, Rank factor = 34/84 in Physics, Applied)
(5) C. H. Lin and R. Chen, “Impact of Mold Geometries and Imprinted Resist Thickness on Velocity Fields for Nanoimprint Lithography,” Japanese Journal of Applied Physics. (2008 accepted.) (SCI, Impact Factor = 1.222, Rank factor = 39/84 in Physics, Applied)
(6) C. H. Lin and R. Chen, “Simulating and Experimental Investigation in Ultrasonic Nanoimprint Lithography,” IEEE Transactions on Nanotechnology. (2006 submitted, 2007 revised) (SCI, Impact Factor = 1.909, Rank factor = 15/32 in Nanoscience & Nanotechnology, 27/206 in Engineering, 38/176 in Materials Science, and 22/84 in Physics)
Conference papers
(1) C. H. Lin and R. Chen, “Impact of Mold Geometries and Imprinted Resist Thickness on Velocity Fields for Nanoimprint Lithography,” 20th International Microprocesses and Nanotechnology Conference, Kyoto, Japan, 5-8 Nov., 2007.
(2) C. H. Lin, R. Chen, C. C. Su, and F. Y. Chang, “Nanofabrication with Ultrasonic Nanoimprint Lithography,” 6th IEEE Conference on Nanotechnology, Cincinnati, USA, 17-20 Jun., 2006. (EI)
(3) C. H. Lin, R. Chen, C. C. Su, and F. Y. Chang, “Ultrasonics for Nanoimprint Lithography,” 5th IEEE Conference on Nanotechnology, Nagoya, Japan, Jul. 11-15, 2005. (EI)
(4) C. H. Lin, R. T. Zheng, and R. Chen, “Ultrasonics for Nanoimprint Lithography,” The Third International Conference on Nanoimprint Nanoprint Technology, Vienna, Austria, 1-3 Dec., 2004.
(5) C. H. Lin, C. C. Wang, and R. Chen, “A Real-Time Micromachined Strain Sensor for MEMS,” Asia-Pacific Conference of Transducers and Micro-Nano Technology 2004, Sapporo, Japan, 4-8 Jul., 2004, pp.432-436
(6) C. H. Lin, H. Y. Tsai, and R. Chen, “Effect of Volumetric Shrinkage in Nanoimprint Lithography,” The Second International Conference on Nanoimprint Nanoprint Technology, Boston, USA, 3-5 Dec., 2003.
(7) Y. L. Lai, C. H. Lin, and Y. D. Wen, “RF MEMS switches using MPMC process,” in Proc. 2nd Workshop on Multi-Project MEMS Chip, pp. 21, July 2003.
(8) Y. L. Lai, L. H. Chang, and C. H. Lin, “Mechatronic design and analysis of RF MEMS switches,” in Proc. Int. Symp. on Mechatronics, pp. 20-31, Nov. 2002.
(9) Y. L. Lai and C. H. Lin, “Mechanical design of RF MEMS capacitive switches,” in Proceeding IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education in the 21st Century, Aug., 2002.
(10) Y. L. Lai and C. H. Lin, “Optimal design of micromachined switches by Taguchi method,” in Proceeding IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education in the 21st Century, Aug., 2002. 國內研討會
(1) 王嘉誠、林建宏、陳榮順,即時量測殘餘應力之微機電感測器,中華民國力學學會第廿九屆全國力學會議,新竹市,2005。
(2) 林建宏、林義成、陳淑容,平行加熱銲接參數之應力分析,中華民國第七屆破壞科學研討會論文集,屏東縣,2002。
(3) 林建宏、林義成、劉展睿,田口方法最佳化平行加熱銲接參數,中國機械工程學會第十八屆全國學術研討會論文集,台北市,2001。
(4) 沈文伸、林建宏、林義成,麻田散體不銹鋼硬面銲補熱疲勞過程裂縫分析,中華民國第六屆破壞科學研討會論文集,屏東縣,2000。
(5) 莊瑛任、林建宏、林義成,吸熱膠銲接之殘留應力分析與實驗,中國機械工程學會第十七屆全國學術研討會論文集,高雄市,2000。
(6) 林義成、莊瑛任、林建宏、陳淑容,吸熱膠體對銲件殘留應力與角變形之研究,中國材料科學學會研討會論文集,高雄市,2000。
NSC Project:

 

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